| Development of method to granulate polymerized acrylic resin |
1955 |
| Quality Kaizen of carbon-film resistors |
1959 |
| Launching metal-film resistor manufacturing line |
1963 |
| Launching silicon wafer fab |
1967 |
| Development/mass-production of transistors/diode/photo-transistors |
1968 |
| Launching GaAsP LED wafer fab |
1972 |
| Development/mass-production of LED display for hand-held calculator |
1973 |
| Development/mass-production of thermal printhead with thick-film
technology * |
1974 |
| Launching thick-film fax printhead mass-production |
1977 |
| Development/mass-production of thermal printhead with partial glaze
layer * |
1978 |
| Development/implementation of dedicated driver IC on substrate for thermal printhead * |
1979 |
| Development and launching LED printhead mass-production |
1987 |
| Development of 2" erase head for rewritable recording media |
2002 |
| Development of 4" erase head with sub-heater for rewritable recording
media and thermal double transfer applications |
2004 |
| Development of 6" large-size erase head for rewritable recording media |
2005 |
| New 8-inch model erase head for rewritable recording media developed |
2007 |
| * Technology still widely used in the industry today. |