株式会社ヒットデバイス logo200                                                                                
 
History of Company and Activities
History of Company
September 2001   HIT Research Laboratory was established to research resistive materials and
                              develop erase heads

September 2002  
Limited Private Company HIT Devices was founded to prepare for preparation of
                           mass-production

January 2004      
 Incorporated as HIT Devices Ltd. and sales network was setup

Activities
2002 Research for various rewritable media and the suitable heating head development started.
          Joint study was conducted with
Afit Corporation for rewritable printer and the result was
           co-presented at
IMI Thermal Printing Conference
2003
Developed and started to market erase heads with unique multiple resistive element
           structure for  improved thermal efficiency

2004
Developed the erasing control method using the unique structure erase head and auxiliary
            heater.      
          The result of this development was presented at
IMI Thermal Printing Conference
2005
Developed and marketed the wider-format (A5 size) erase head with newly employed
           methods to reduce temperature variation for improved uniformity.
          Paper was presented at
IMI Thermal Printing Conference
2006
Size reduction and efficiency improvement were made to the erase head.   A4 size
           erase head was developed and stared to be marketed
          The paper was presented at European IJTP Conference,
IMI Thermal Printing Conference
           
and IS&T NIP22 Conference
2007
Developed a high-speed 8-inch wide erase head and the result was presented at
            IS&T NIP23 Conference
2008
Erase head for RFID Kanban card was presented at IMI Thermal Printing Conference and
            IS&T NIP24 Conference
2009
Segmented mufti-digit thermal printhead (co-developed product) was presented at
             IMI Thermal Printing Conference
and co-presented at IS&T NIP25 Conference
             
with Lathem Time

President's Career Summary
1959   Quality Kaizen of carbon-film resistors
1963  
Launching metal-film resistor manufacturing line
1967  
Launching silicon wafer fab
1968  
Development/mass-production of transistors/diodes/photo-transistors
1972  
Launching LED GaAsP wafer fab
1973  
Development/mass-production of 8-segment LED display for hand-held calculator
1974  
Development/mass-production of thermal printhead with thick-film and thin-film technologies
1977  
Launching mass-production of thick-film thermal printhead for facsimile application
1978  
Development/mass-production of thermal printhead with partial glaze layer
1979  
Development/implementation of dedicated driver IC on thermal printhead substrate
1987  
Development and launching LED printhead mass-production
History while he was with Rohm Co. Ltd
.
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2001  
Established HIT Research Laboratory
2002  
Founded Limited Private Company HIT Devices
           
Development of 2-inch erase head for rewritable media
2003  
Obtained Japanese patent on erase head for reversible direct thermal printing media
2004  
Company incorporated as HIT Devices Ltd.
           Development of 4-inch head with auxiliary heater for erasing and thermal transfer
           application

2005  
Development of 6-inch erase head
          Obtained US patent on erase head for thermal reversible printing media

2006  
Obtained Japanese patent on erase head for thermal reversible printing media
2007  
Development of new type 8-inch erase head
          Obtained US patent on erase head for thermal reversible printing media

2008  
Obtained Japanese patent on erase head for thermal reversible printing
2009  
Obtained on erase head for thermal reversible printing from Germany, France and England
          Obtained 2 Japanese patents on erase head for thermal reversible printing
 
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