September 2001 HIT Research Laboratory was established to research resistive materials
and
develop erase heads
September 2002 Limited Private Company HIT Devices was founded to prepare for preparation
of
mass-production
January 2004 Incorporated as HIT Devices Ltd. and sales network was setup |
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| President's Career Summary |
1959 Quality Kaizen of carbon-film resistors
1963 Launching metal-film resistor manufacturing line
1967 Launching silicon wafer fab
1968 Development/mass-production of transistors/diodes/photo-transistors
1972 Launching LED GaAsP wafer fab
1973 Development/mass-production of 8-segment LED display for hand-held calculator
1974 Development/mass-production of thermal printhead with thick-film and thin-film
technologies
1977 Launching mass-production of thick-film thermal printhead for facsimile application
1978 Development/mass-production of thermal printhead with partial glaze layer
1979 Development/implementation of dedicated driver IC on thermal printhead substrate
1987 Development and launching LED printhead mass-production
History while he was with Rohm Co. Ltd.
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2001 Established HIT Research Laboratory
2002 Founded Limited Private Company HIT Devices
Development of 2-inch erase head for rewritable media
2003 Obtained Japanese patent on erase head for reversible direct thermal printing
media
2004 Company incorporated as HIT Devices Ltd.
Development of 4-inch head with
auxiliary heater for erasing and thermal transfer
application
2005 Development of 6-inch erase head
Obtained US patent on erase head for thermal reversible printing media
2006 Obtained Japanese patent on erase head for thermal reversible printing
media
2007 Development of new type 8-inch erase head
Obtained US patent on erase head
for thermal reversible printing media
2008 Obtained Japanese patent on erase head for thermal reversible printing
2009 Obtained on erase head for thermal reversible printing from Germany, France
and England
Obtained 2 Japanese patents on
erase head for thermal reversible printing |
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