Major Heating Head Products for

Rewritable printer: Erasing / partial erasing
Thermal transfer printer: Protective layer coating / double transfer process.
Heat treatment process: Heat-curing adhesive / heat-lamination process.
This is the sixth year since HIT Devices Ltd. was founded at Kyoto Research Park
During this time, rewritable media has grown into variety of applications including IC tags, RFID and non-contact IC cards. In order to answer the requests for the new usages, we have developed the erase heads for A4-size (210 mm / 8 inches) applications requests from the market by utilizing our long experience in the industry, new materials and new technology. The products are well received.
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HIT Devices Ltd. in
Kyoto Research Park Building 1
HIT Devices
US Office 
Nashville, TN
2002  Investigation for the characteristics of various thermal rewritable recording media and development of heating head suitable for erasing.
Joint study was conducted with Afit Corporation for the rewritable printer and the results were co-presented at IMI Thermal Conference in April, 2002
2003 Developed and started marketing erase head with unique structure with multiple resistive elements to improve the thermal efficiently increase
2004 Development of sub-heater structure and and erasing control method using the erase heads with the unique structure. The paper was presented at IMI Thermal Conference in April, 2004
2005 Developed and marketed the A5-size wider-format erase head with low temperature variation which was achieved by employing various new methods for uniformity improvement. The paper was presented at IMI Thermal Conference in May, 2005
2006 Made the erase head smaller & more efficient and also developed A4-size head. The paper was presented at European IJTP Conference in March, IMI Thermal Conference in May and IS&T NIP22 Conference in September.
2007 Developed a high-speed 8.5-inch wide erase head and the result was presented at IS&T NIP23 Conference in September.
Copyright © 2007, HIT Devices Ltd. All Rights Reserved.